The compact, advance and flexible UV Laser Marking Machine is best for usage that needs the processing of non-flat parts and different surfaces. It is widely used in making small holes, LCD, TFT marking and slicing. Especially meet for areas such as marking on packing materials of medicines and foods, drilling micro-pores, great-speed partition of glass materials and complex graphical cutting of silicon wafer. UV Laser Marking Machine has outstanding exactness marking capability with less heat affected zone.
Technical Specifications
Beam Output |
Steered beam |
Automatic Grade |
Automatic |
Power(W) |
2 W |
Laser Type |
CO2 |
Standard User Interface |
Smart Graph (on optional external Windows 7 PC) |
Standard IO Connectivity |
Ethernet |
Plant Air Used |
No |
Maximum Print Speed |
500 characters/sec |
Maximum Power |
2-Watt |
Maximum Line Speed |
984 ft/min (300 m/min) |
Laser Wavelength Options |
355 nm |
Laser Tube |
Pulsed Nd YVO4 laser (Vanadat), diode-pumped |
Laser Source Expected Life |
15,000-25,000 hours |
Laser Cooling |
Air cooled |
Environmental Protection |
Marking unit IP 20 /Supply unit IP 21 |
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